Heterogeneous Integration, IC Packaging and Testing
Training Provider: NATIONAL UNIVERSITY OF SINGAPORE
Course Reference: TGS-2024046526
S$5,800
About This Course
This course aims to provide an introductory coverage on heterogeneous integration, IC packaging and testing with case studies provided.
What You'll Learn
Switching from �only front-end node scaling� to �combination with back-end scaling�, heterogeneous integration is to integrate multiple chiplets with different functionalities. Each fabricated with best fit node in terms of technology and economic aspects. It is the �low hanging fruit� for the new era of technological and scientific advances to continue and complement the progression of Moore�s-Law scaling into the future. Packaging, from device packaging to system packaging, will form the vanguard to this enormous advance. This course aims to provide an introductory coverage on heterogeneous integration, IC packaging and testing with case studies provided.
Entry Requirements
Minimum entry is a Bachelor�s degree (or equivalent) in STEM.
Course Details
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